ESM100 is a revolutionary product for final finishing of PCB's. Based on the unique ESM-technology, ESM100 is a universal final finish with a cost/performance ratio unsurpassed by competing technologies.
ESM100 has a price setting to that of traditional tin/lead (HASL) but performance are equal to very expensive gold and palladium based processes. ESM100 has been acknowledged by professionals as a small revolution when it comes to surface finishing of PCB's.
- Excellent solderability. Wetting time around 0,15 seconds.
- Solderability unaffected by multiple solder cycles.
- 2 year shelf life.
- Bondable with gold and aluminium wire.
- Excellent choice for HDI boards due to conformal coatings.
- Touchpad compatible.
- 100% coverage of the copperwires - no rejections.
- Excellent electrical conductivity (important for RF boards).
- Excellent heat dissipation.
- Lowered PIM losses (-30dB compared to immersion silver).
- Extremely easy and robust processing for the PCB manufacturer.
There is a dramatic difference between ESM100 and the so called immersion silvers currently available in the market. The ESM100 is an autocatalytic silver plating process, and as such, it gives both thicker and denser silver layers than an immersion silver process. The pictures below gives an indication of the quality of the layer deposited with ESM100 compared with the market leader immersion silver.
ESM100
Immersion Silver
