ASIG is a final finish for PCB's and wafer level packaging applications. ASIG has been developed as an alternative to ENIG due to the many quality drawbacks found in this process such as blackpads and gold embrittlement of the solderjoint. ASIG has the best bondability in the industry. When bonding with gold wire, it is many times cheaper than the Ni/Pd/Au final finish used today for gold wire bonding. In addition to solving the quality issues in ENIG, the ASIG final finish is also a cheaper alternative than ENIG.
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